?url_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Adc&rft.relation=http%3A%2F%2Fmiis.maths.ox.ac.uk%2Fmiis%2F330%2F&rft.title=Void+elimination+in+screen+printed+thick+film+dielectric+pastes&rft.creator=Wilson%2C+S.&rft.creator=Howison%2C+S.D.&rft.creator=Parker%2C+D.&rft.creator=Fitt%2C+A.D.&rft.creator=Harlen%2C+O.&rft.creator=Myers%2C+T.&rft.creator=Please%2C+C.P.&rft.creator=Hinch%2C+E.+J.&rft.creator=Chapman%2C+S.+J.&rft.creator=King%2C+J.&rft.creator=Duursma%2C+G.&rft.creator=Beckum%2C+F.+van&rft.creator=Riley%2C+D.&rft.subject=Materials&rft.description=The+problem+is+to+understand+the+mechanisms+for+the+formation+and+evolution+of+defects+in+wet+screen+printed+layers.+The+primary+objective+is+to+know+how+best+to+alter+the+properties+of+the+paste+(rather+than+the+geometry+of+the+screen+printing+process+itself)+in+order+to+eliminate+the+defects.%0D%0A%0D%0AWith+these+goals+in+mind+the+work+done+during+the+Study+Group+reported+here+was+as+follows%3B+to+describe+a+simple+model+for+the+closure+of+craters%2C+a+model+for+the+partial+closure+of+vias%2C+a+possible+mechanism+for+the+formation+of+pinholes+and+finally+a+more+detailed+consideration+of+the+screen+printing+process.&rft.date=1996&rft.type=Study+Group+Report&rft.type=NonPeerReviewed&rft.format=application%2Fpdf&rft.language=en&rft.identifier=http%3A%2F%2Fmiis.maths.ox.ac.uk%2Fmiis%2F330%2F1%2FVoid-elemination-in-screen-printed-thick-film-dielectric-pastes.pdf&rft.identifier=++Wilson%2C+S.+and+Howison%2C+S.D.+and+Parker%2C+D.+and+Fitt%2C+A.D.+and+Harlen%2C+O.+and+Myers%2C+T.+and+Please%2C+C.P.+and+Hinch%2C+E.+J.+and+Chapman%2C+S.+J.+and+King%2C+J.+and+Duursma%2C+G.+and+Beckum%2C+F.+van+and+Riley%2C+D.++(1996)+Void+elimination+in+screen+printed+thick+film+dielectric+pastes.++%5BStudy+Group+Report%5D+++++