eprintid: 330
rev_number: 14
eprint_status: archive
userid: 7
dir: disk0/00/00/03/30
datestamp: 2011-06-06 16:39:07
lastmod: 2015-05-29 19:57:13
status_changed: 2011-06-06 16:39:07
type: report
metadata_visibility: show
item_issues_count: 0
creators_name: Wilson, S.
creators_name: Howison, S.D.
creators_name: Parker, D.
creators_name: Fitt, A.D.
creators_name: Harlen, O.
creators_name: Myers, T.
creators_name: Please, C.P.
creators_name: Hinch, E. J.
creators_name: Chapman, S. J.
creators_name: King, J.
creators_name: Duursma, G.
creators_name: Beckum, F. van
creators_name: Riley, D.
title: Void elimination in screen printed thick film dielectric pastes
ispublished: pub
subjects: materials
studygroups: esgi29
companyname: Du Pont Electronics
full_text_status: public
abstract: The problem is to understand the mechanisms for the formation and evolution of defects in wet screen printed layers. The primary objective is to know how best to alter the properties of the paste (rather than the geometry of the screen printing process itself) in order to eliminate the defects.

With these goals in mind the work done during the Study Group reported here was as follows; to describe a simple model for the closure of craters, a model for the partial closure of vias, a possible mechanism for the formation of pinholes and finally a more detailed consideration of the screen printing process.
date: 1996
citation:   Wilson, S. and Howison, S.D. and Parker, D. and Fitt, A.D. and Harlen, O. and Myers, T. and Please, C.P. and Hinch, E. J. and Chapman, S. J. and King, J. and Duursma, G. and Beckum, F. van and Riley, D.  (1996) Void elimination in screen printed thick film dielectric pastes.  [Study Group Report]     
document_url: http://miis.maths.ox.ac.uk/miis/330/1/Void-elemination-in-screen-printed-thick-film-dielectric-pastes.pdf