The MIIS Eprints Archive

Void elimination in screen printed thick film dielectric pastes

Wilson, S. and Howison, S.D. and Parker, D. and Fitt, A.D. and Harlen, O. and Myers, T. and Please, C.P. and Hinch, E. J. and Chapman, S. J. and King, J. and Duursma, G. and Beckum, F. van and Riley, D. (1996) Void elimination in screen printed thick film dielectric pastes. [Study Group Report]



The problem is to understand the mechanisms for the formation and evolution of defects in wet screen printed layers. The primary objective is to know how best to alter the properties of the paste (rather than the geometry of the screen printing process itself) in order to eliminate the defects.

With these goals in mind the work done during the Study Group reported here was as follows; to describe a simple model for the closure of craters, a model for the partial closure of vias, a possible mechanism for the formation of pinholes and finally a more detailed consideration of the screen printing process.

Item Type:Study Group Report
Problem Sectors:Materials
Study Groups:European Study Group with Industry > ESGI 29 (Oxford, UK, Mar 18-22, 1996)
Company Name:Du Pont Electronics
ID Code:330
Deposited By: Dr Kamel Bentahar
Deposited On:06 Jun 2011 16:39
Last Modified:29 May 2015 19:57

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