Void elimination in screen printed thick film dielectric pastes

Abstract

The problem is to understand the mechanisms for the formation and evolution of defects in wet screen printed layers. The primary objective is to know how best to alter the properties of the paste (rather than the geometry of the screen printing process itself) in order to eliminate the defects.

With these goals in mind the work done during the Study Group reported here was as follows; to describe a simple model for the closure of craters, a model for the partial closure of vias, a possible mechanism for the formation of pinholes and finally a more detailed consideration of the screen printing process.